Flying Edge (Shawl)
Cause: Insufficient clamping force or mold parting surface wear, resulting in melt overflow.
Countermeasures: Optimize clamping pressure parameters, periodically grind the parting surface or replace the guide pillar guide bush.
Shrinkage (dents)
Reason: Insufficient holding time or irrational design of the cooling system, resulting in uneven shrinkage in thick-walled areas.
Countermeasures: Extend the holding pressure time, optimize the layout of the cooling water circuit, and install additional follower water circuits if necessary.
Fusion marks and bubbles
Cause: Melt temperature is too low or poor exhaust, especially notable in the molding of complex wire harness connectors.
Countermeasures: Raise the barrel temperature to the recommended value for engineering plastics (e.g. PC materials need to be pre-dried at 120-150℃), and install additional exhaust tanks or vacuum-assisted exhaust.
Difficulty with sprue release
Reason: Insufficient finish of the conical hole of the sprue sleeve (Ra>0.4μm) or failure of the pulling rod
Countermeasure: Adopt standard sprue parts, regularly grind the cone hole and configure double ejector mechanism.
Dynamic/Stationary Mold Offset
Reason: The self-weight of the large mold leads to uneven force on the guide pillar, and the perpendicularity of the guide pillar hole is super poor (>0.02mm/m).
Countermeasure: Adopt one-time boring process after the dynamic and fixed molds are combined, and add a cylindrical positioning key (diameter ≥20mm) during processing.
Top bar breaks and leaks
Reason: Uneven force on ejector system or insufficient strength of ejector rod material (recommended SKD61 heat treatment HRC50-55).
Countermeasures: Optimize the density of top bar layout (spacing ≤ 50mm) and adopt stepped top bar structure.
Loss of dimensional accuracy
Reason: Mold temperature fluctuation (±2℃ or more) or material shrinkage calculation deviation (e.g. PA66 shrinkage 1.5-2.5%).
Countermeasure: Adopt mold temperature controller to control temperature accurately (±0.5℃), and correct the shrinkage compensation value through Moldflow simulation.
Hot runner system abnormality
Cause: Localized failure of the heating coil or blockage of the hot nozzle, resulting in uneven melt temperature.
Countermeasures: Configure multi-point temperature monitoring system and dismantle and clean the heat nozzle regularly (cycle ≤ 50,000 mold times).
Accelerated life decay
Reason: Abrasive wear of engineering plastics (e.g. PPS with 40% fiberglass) on the cavity (wear rate > 0.01mm/ 10,000 die times).
Countermeasures: Use TD treatment or DLC coating (thickness of 3-5μm), and establish a mold use file to track maintenance cycles.
Sudden card mode
Cause: Lubrication failure of the slider mechanism or intrusion of foreign matter (probability of occurrence about 0.3-0.5%).
Countermeasures: Configure automatic lubrication system (oil injection interval ≤ 500 mold times), install mold protection sensor.
Modular design: Standardization of electrodes, sliders and other components (module reuse rate increased by more than 30%), shortening the development cycle.
Intelligent monitoring: integrated pressure/temperature sensor (sampling frequency ≥100Hz), realizing abnormal real-time warning.